Etching (Etch) is a critical step in semiconductor manufacturing, microelectronic integrated circuit (IC) fabrication, and micro-nano manufacturing processes. It selectively removes material from a semiconductor substrate surface or surface film according to a mask pattern or specific design requirements. As a core patterning process intrinsically linked to photolithography, etching technology is primarily categorized into Dry Etching and Wet Etching. Pluto possesses extensive expertise in diverse advanced etching processes. We specialize in developing customized etching solutions that deliver exceptional results combined with high cost-effectiveness, tailored to meet your specific requirements.
Our etching technology is widely applied in: Semiconductor Device Manufacturing,Integrated Circuit (IC) Fabrication,Thin-Film Circuits,
Printed Circuit Board (PCB) Microfabrication,Other fields requiring high-precision micro-nano pattern transfer.
In-Situ Chip offers a range of cutting-edge etching technologies to address diverse material and structural needs:
1.Deep Silicon Etching (DRIE - Deep Reactive Ion Etching):
Wafer Size: Up to 8 inches
Achieves High Aspect Ratios: ≥ 5:1
Ion Beam Etching (IBE):
Specializes in precision etching of Metal Materials
Wafer Size: Up to 6 inches
Reactive Ion Etching (RIE) / Inductively Coupled Plasma Etching (ICP):
Provides high-precision, highly anisotropic etching capabilities for various materials.
