Process introduction
Etching (Etch) is the technique of selective etching of a semiconduclor substrate surface or surace coverage flm according to a mask palter ordesign requirement, and is a fairly important step in the semiconductor manufacturing process, microelectronic lC manufacturing process and micronano manufacturing process.lt is a malor process of palterned (paltern) procesing assoclated with photolthography. Etching is divided into dryetching and wet etching. At present, has mastered a varlely of etching processes, and wil design etching solutions with good etchingeffect and high cost perfommance according to customers' needs.
Technical application
Etching technology is used in semiconductor devices, integrated circuit manufacturing, thin film circuits, printed circuits and other micrographicsprocessing.
Process capability
Deep Silicon Etching (DRlE) : wafers 8 inches and below, depth-to-width ratio 5:1
lon Beam etching (lBE) : Metal etching, 6 inches and below
Reactive ion etching (RlE),inductively coupled (lCP) plasma etching
Etching material
Silicon, silicon oxide, silicon nitride, metal, guartz and other materials
Etching (Etch) is a critical step in semiconductor manufacturing, microelectronic integrated circuit (IC) fabrication, and micro-nano manufacturing processes. It selectively removes material from a semiconductor substrate surface or surface film according to a mask pattern or specific design requirements. As a core patterning process intrinsically linked to photolithography, etching technology is primarily categorized into Dry Etching and Wet Etching. Pluto possesses extensive expertise in diverse advanced etching processes. We specialize in developing customized etching solutions that deliver exceptional results combined with high cost-effectiveness, tailored to meet your specific requirements.
Our etching technology is widely applied in: Semiconductor Device Manufacturing,Integrated Circuit (IC) Fabrication,Thin-Film Circuits,
Printed Circuit Board (PCB) Microfabrication,Other fields requiring high-precision micro-nano pattern transfer.
